10 times higher, processor transistors will reach 1 trillion in 2030

（The picture comes from the Internet）

　　According to foreign media reports, at the HotChips 34 conference last week, Intel CEO Pat Gelsinge said that small chip design and advanced packaging will continue to flourish in the next 10 years. Even, by 2030, transistor density will increase by a factor of 10, which will allow Intel to grow to have 1 trillion transistors on a chip.

　　Pat Gelsinger said that chip fabs are no longer providing single wafer production, but complete system-level services, including wafer production, advanced packaging and integrated software technology. This approach is called System on Package (SOP).

　　Pat Gelsinger explained that rack-mounted servers in the data center are very fashionable, and this is the development model that relies on SOP as the mainstay, that is, when SOP becomes an advanced system, the overall continuous development can be seen.

　　In fact, part of this change involves node scaling and chip stacking. Intel has discussed before that it will abandon FinFET technology in 2024 in favor of gate-all-around (GAA) RibbonFET technology, which means it will start adopting the new technology at its intel 20A node. At the same time, it will also be supported by PowerVIA back power supply technology. Pat Gelsinger believes that this kind of process and packaging technology advances will provide unlimited progress for semiconductors.

　　“Today, there are about 100 billion transistors on a chip. With gate-all-around (GAA) RibbonFET technology, a new basic transistor structure will be created that is expected to enable transistors by 2030. 1 trillion," said Pat Gelsinger.

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